● SMD type zinc oxide based ceramic chip
● Lead free plating termination provided good solderability characteristic
● Insulator overcoat keeps excellent low and stable leakage current
● Quick response time (<1ns)
● Low clamping voltage
● High transient current capability
● Meet IEC 61000-4-2, 61000-4-4, and 61000-4-5 standard
● Compact size for EIA 0201/0402/0603/1206
MLVG
● Lead free type
● SMD type zinc oxide based ceramic chip
● Insulator over coat keeps excellent low and stable leakage current
● Plating termination provided good solderability characteristic
● Wide operating voltage range, VDC: 5.5V to 18V
● Quick response time (<1ns)
● Low clamping voltage
● Meet IEC 61000-4-2 standard
● Low capacitance can meet high speed single transient voltage protection.
MLV Array
● SMD type zinc oxide based ceramic chip
● Lead free plating termination provided good solderability characteristic
● Insulator overcoat keeps excellent low and stable leakage current
● Quick response time (<1ns)
● Low clamping voltage
● High transient current capability
● Meet IEC 61000-4-2, 61000-4-4, and 61000-4-5 standard
